Overview

The UP1200 is a multi-purpose, continuous flow, Reflow Soldering Oven capable of temperatures up to 400°C. Designed to process up to 300mm wafers and any application requiring full chamber cover gas with <5ppm O2 levels across all zones, virtually no vibration, and complete profile customization. Utilizing Sikama’s unique contact conduction heating in combination with thermal convection and radiant heating which provides unmatched thermal energy transfer and the lowest energy use of any comparable reflow oven. This product is CE certified and meets SEMI safety and ergometric standards.