Overview

The BT301 Batch Reflow Oven is a revolutionary new product that allows you to match your thermal process specifications for preheat, soak, reflow, and cooling on the first PCB you produce. It has the thermal conditions of an inline reflow system in a bench-top unit with a full dynamic thermal process. The use of nitrogen for lead-free assembly in the reflow process improves solder joint strength and reduces oxidation. The BT301N is ideal for product development, prototyping, and small series production. Solder profiles are easily set up and stored through the control app of the BT301N’s exclusive hardware control on an Android operating system. The dynamic control system takes care of the size and complexity of your assembly and makes it a closed-loop process, something only large and costly thermal systems can normally offer. This makes the BT301N a great choice for those looking for an efficient and cost-effective solution for their PCB production needs.