Description
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.Configuration
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM Model Description
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ULVAC
SME-200J
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110833
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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ULVAC
SME-200J
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
110833
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
A mask bonding system that transfers the wafer and mask to the sputtering device chamber L after bonding for film deposition processing.Configuration
Wafer: 8 inches, processed one by one Metal Mask: Φ230 mm × t100 μm Configuration: L chamber × 1 T chamber × 1 Etching chamber × 1 Sputtering chamber × 4 Transfer Chamber: Robot with 2 pick-up specifications Etching Chamber: Power supply antenna 1KW, Bias: 600W, Substrate electrode water-cooled electrostatic chuck Sputtering Chamber: 4 chambers, Cathode: Magnet rotary cathode (upper side), DC: 10KW, Substrate electrode: Water-cooled electrostatic chuckOEM Model Description
None ProvidedDocuments
No documents