ULVAC

CERAUS ZX 1000

SME-200J

The CERAUS Zi-1000 is a high cost-performance metalization system designed for multi-layer wiring applications. It offers a productive configuration by optimizing itself for various processes, including high directional barrier metal sputtering, Al flow sputtering, and copper flow technology. This makes it an efficient and cost-effective solution for metalization needs. 

CERAUS ZI 1000

SIV-500	

STD-1500VR

The SIV inline system is a PVD tool that can deposit LCO, LPO and ITO onto panels with a substrate size of up to 1,000mm x 1,000mm. The maximum substrate size is 500mm. It has an RTA module integrated and a special designed chamber for LCO and LPO deposition. The tool is equipped with a special cathode for particle reduction and can deliver high quality/density LCO/LPO target. The system can perform pass-by or continuous deposition and can also deposit ITO.

SIV-200S

SRH-420MC

SIH-300RD	

SCH-135T

SV-4540

SCH-135A

Z-1000

ENTRON

SMD-650C

SH-350H

SRH 820

SDH-4550L

SME-200

SMD-1800X

SMD 450C

MUE-ECO

SX-400

SIV-3545

BC6643

SMD-450

SH-450 SPECIAL TYPE 

MPS-4000-L4(SP)

Ulvac: Ceraus Z-2000 cluster tool, very high vacuum (5e-9), aluminum and barrier metal applications, can be clustered to tungsten CVD system for integrated PVD/CVD applications.

CERAUS Z-2000

MPS-6000-C4S1

SV-9040

SV-9040-T14

SIH-3040

ULDIS-903CHL

The CS-200 is a sputtering system equipped with a 4-inch Magnetron cathode for various target materials. It is suitable for research and development, as well as small and medium-scale volume production. The system is designed for high-performance and high reliability sputtering, based on ULVAC’s extensive experience and sputtering technology portfolio. It is an ideal choice for those looking for a reliable and versatile sputtering system.

CS-200

SH-350-D06

SPW-030

MAGEST S200

MPS-2000-C8

ULTECH-4543

SPZ-1000

MPS-2000-HC2

SH-450

SH-450-C10

Standard exhaust system: 12” Cryopump
Ultimate pressure: 6.7e-5Pa
Depot direction: side
Deposition Area Uniformity Stationary Rotation: L300mm±10%	

SV-6040

MLK-3000N

The MLX-3000N is a multi-chamber sputtering system that offers a flexible modular configuration with up to 5 process chambers and a random access robotic wafer transfer. It includes a unique dual pole, electromagnetic sputter source, a low damage high-rate etch-cleaning, and a new wafer heating method. These features, combined with improved process technology for R&D production, make the MLX-3000N a flexible and versatile system for various applications.

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Top ULVAC PVD / Sputtering

CERAUS ZX 1000

SME-200J

CERAUS ZI 1000

SIV-500

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