Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Eclipse Mark IV is the latest generation PVD tool from the highly successful Eclipse family. It offers the lowest Cost-of-Ownership through high throughput, a small footprint, and high reliability with exceptional process performance. The system achieves high throughput in a high vacuum environment through the use of serial wafer handling, resulting in 80% fewer wafer transfers than a traditional cluster tool. The Eclipse Mark IV has a footprint of 44 square feet and can be configured for etch or deposition, providing full capability for today’s contact, barrier, interconnect, resistor, and packaging films for Silicon, GaAs and CCD substrates. Wafer temperature is regulated by backplane heaters and the chambers have world class vacuum leak rates and base pressures.Documents
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TEL / MRC
ECLIPSE MARK IV
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79339
Wafer Sizes:
6"/150mm
Vintage:
Unknown
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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TEL / MRC
ECLIPSE MARK IV
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79339
Wafer Sizes:
6"/150mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Eclipse Mark IV is the latest generation PVD tool from the highly successful Eclipse family. It offers the lowest Cost-of-Ownership through high throughput, a small footprint, and high reliability with exceptional process performance. The system achieves high throughput in a high vacuum environment through the use of serial wafer handling, resulting in 80% fewer wafer transfers than a traditional cluster tool. The Eclipse Mark IV has a footprint of 44 square feet and can be configured for etch or deposition, providing full capability for today’s contact, barrier, interconnect, resistor, and packaging films for Silicon, GaAs and CCD substrates. Wafer temperature is regulated by backplane heaters and the chambers have world class vacuum leak rates and base pressures.Documents
No documents