Description

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Configuration

1 (1) Fully automated 25 wafer’s Cluster Tool with Three PVD Process Modules (One-Mo, One-AlScN and One-AlN) and One Trimming Module Cluster Tool Consists of the following components: 1A (1) Transfer Module (TM) • 5-ports, machined from a single block of aluminum, • “Genmark Automation” vacuum robot, • Omron retroreflective optical sensor in the transfer module provides wafer movement monitoring, • Independently pumped with Turbo/rough pumps. • Integrated Residual Gas Analyzer (RGA) 1B (1) LoadLock (LL) • Machined from a single block of aluminum. • Cassette indexing for 25 wafers is provided by Genmark Automation robot • Independently pumped with high-capacity rough pump. 1C (1) AlScN PVD Process Module • PM - Rectangular, machined from single aluminum block. • The Process Module is independently pumped. • Internal Water Cooling • Process controller- OPTO22 • Gas flow control- 2 BrooksInst MFC’s • Deposition source – Dual AC Magnetron with secondary DC power supply • Wafer Rotation • Integrated Laser Interferometer Thickness Monitor 1D (1) AlN PVD Process Module • PM - Rectangular, machined from single aluminum block. • The Process Module is independently pumped. • Internal Water Cooling • Process controller- OPTO22 • Gas flow control- 2 BrooksInst MFC’s • Deposition source – Dual AC Magnetron with secondary DC power supply • RF-substrate pre-clean, including RF power generator and matching network • Wafer Rotation • Integrated Laser Interferometer Thickness Monitor 1E (1) Trimming Module • Rectangular machined from single Aluminum block. • The Process Module is independently pumped with turbo/rough pumps. • Gas flow control 1 MFC • Module is based on focused ion beam source and X-Y substrate motion assembly • 180W Ion source – proprietary cold-cathode ion source based on accelerator with closed electron drift. • Powered by High Voltage DC power supply • Process execution - automated. 1F (1) Mo PVD Process Module • PM - Rectangular, machined from single aluminum block. • The Process Module is independently pumped. • Internal Water Cooling • Process controller- OPTO22 • Gas flow control- 1 BrooksInst MFC’s • Deposition source – Dual DC Magnetron • Wafer Rotation • RF-substrate pre-clean, including RF power 1G (1) Discount for used power supplies (one AE PEII for AlN, one AE PEII for AlScN, two AE MDX for Mo) 1H (1) Installation and one year warrantee support in Taiwan included 1I (1) Shield for Trimming Chamber, 100kW-h kit. Re-clean by customer every 30kW-h. Good for 3 cleanings included 1J (1) Shield for Trimming Chamber, 300kW-h kit. Re-clean by customer every 30kW-h. Good for 10 cleanings included 1K (1) Shield Set (AlN deposition module) included 1L (1) Shield Set (AlScN deposition module) included 1M (1) Shield Set (Mo deposition module) included 1N (1) Al target Set, using for qualification included 1O (1) Mo Target Set, using for qualification included