Description
CU PLATINGConfiguration
CU PLATINGOEM Model Description
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.Documents
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APPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
Verified
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56163
Wafer Sizes:
12"/300mm
Vintage:
2000
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Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
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Refurbishment Services
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View AllAPPLIED MATERIALS (AMAT)
ENDURA ELECTRA Cu
CATEGORY
PVD / Sputtering
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
56163
Wafer Sizes:
12"/300mm
Vintage:
2000
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
CU PLATINGConfiguration
CU PLATINGOEM Model Description
The Endura Electra Cu™ System is a production-proven solution for copper interconnect metallization. It utilizes IMP-based technologies in a revolutionary process sequence to deposit a barrier layer of tantalum (Ta) or tantalum nitride (TaN), followed by a thin seed layer of copper in an IMP Cu chamber. This provides the critical base needed for successful subsequent bulk copper fill. The Endura Electra Cu system is currently being used by industry leaders and is the first-production capable system of its kind.Documents
No documents