Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.Documents
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TEL / TOKYO ELECTRON
WDF DP
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
12887
Wafer Sizes:
8"/200mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
WDF DP
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
12887
Wafer Sizes:
8"/200mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The WDF DP is a unique device that offers the dual functionality of a wafer prober and a dicing frame handler. It is specifically designed for CSP/WLCSPs, one of the fastest growing markets in recent years. The WDF DP can handle both regular wafers and wafers/substrates on dicing frames, resulting in production efficiency improvement. Additionally, the WDF DP helps reduce testing costs because of its change-over-kit less solution and higher index time as compared with a conventional handler. Some of its key features include wafer and dicing frame handling capability without use of a change-over-kit, over twice the throughput of conventional horizontally moving handler, special alignment available for diced wafers, hot temperature testing (max : 150℃), and flat-top for the large test-head. Overall, the WDF DP is an innovative solution that can help improve production efficiency and reduce testing costs.Documents
No documents