Description
TEL PRECIO NANO WITH SINGLE FOUP LOADERConfiguration
No ConfigurationOEM Model Description
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).Documents
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TEL / TOKYO ELECTRON
P-12XLn
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111974
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
P-12XLn
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
111974
Wafer Sizes:
12"/300mm
Vintage:
2005
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
TEL PRECIO NANO WITH SINGLE FOUP LOADERConfiguration
No ConfigurationOEM Model Description
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).Documents
No documents