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P12XLn/VIP3A/WAPP/ASU/ H&C Gold Chuck/ TS1 loader/ 220V/ D230 chillerOEM Model Description
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).Documents
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TEL / TOKYO ELECTRON
P-12XLn
Verified
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108657
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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TEL / TOKYO ELECTRON
P-12XLn
CATEGORY
Probers
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
108657
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
P12XLn/VIP3A/WAPP/ASU/ H&C Gold Chuck/ TS1 loader/ 220V/ D230 chillerOEM Model Description
The P-12XLn is a next-generation wafer prober developed for 300mm testing. It is part of the P-12XL series, which also includes the P-12XL, P-12XLn+, and P-12XLm models. The P-12XLn retains the acclaimed on-axis alignment feature of previous models while being able to handle reduced pad size. The system assures high-accuracy probing under both high and low temperature conditions, thanks to its hot and cold temperature, heat dissipation thermal systems. Additionally, the P-12XLn’s rigid deflection-resistant stage can handle higher pin counts with lower mechanical deflection. Other features of the P-12XLn include an automation system, equipment standardization, clean technology, PC-aided product file management and remote operation, and software compatibility with the P-8 series probers. The P-12XLn is capable of handling CIM/FA, such as AMHS, and can measure wafer sizes of 300mm, 200mm, and 150mm (option).Documents
No documents