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DISCO DFM2700
    Description
    No description
    Configuration
    DFM2700+8760
    OEM Model Description
    The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.
    Documents

    No documents

    DISCO

    DFM2700

    verified-listing-icon

    Verified

    CATEGORY

    Polishing and Grinding
    Last Verified: Over 60 days ago
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    79183

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    DISCO DFM2700
    DISCODFM2700Polishing and Grinding
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    DISCO

    DFM2700

    verified-listing-icon

    Verified

    CATEGORY

    Polishing and Grinding
    Last Verified: Over 60 days ago
    listing-photo-537ec2b090f948fcb8dac37e9030c601-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    79183

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    DFM2700+8760
    OEM Model Description
    The DFM2700 is a tape mounter that peels off the backside protection tape after a 300mm thinned wafer has been attached to a dicing ring frame. When configured in an in-line system with a grinder or polisher (DGP8760, DFG8560, DFP8160, DFE8060), it performs all processing smoothly from then grinding the wafer to attaching it to the dicing ring frame and peeling off the backside protection tape. Since no handling is carried out by the operator, it provides stable handling and contributes to yield improvement of the thinning process.
    Documents

    No documents

    Similar Listings
    View All
    DISCO DFM2700
    DISCO
    DFM2700
    Polishing and GrindingVintage: 0Condition: UsedLast Verified: Over 60 days ago