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ACCRETECH / TSK PG300RM
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.
    Documents

    No documents

    ACCRETECH / TSK

    PG300RM

    verified-listing-icon

    Verified

    CATEGORY

    Polishing and Grinding
    Last Verified: Over 60 days ago
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    14240


    Wafer Sizes:

    Unknown


    Vintage:

    2006

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    ACCRETECH / TSK PG300RM
    ACCRETECH / TSKPG300RMPolishing and Grinding
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ACCRETECH / TSK

    PG300RM

    verified-listing-icon

    Verified

    CATEGORY

    Polishing and Grinding
    Last Verified: Over 60 days ago
    listing-photo-A3acvoIE0qzWVc22or-8udAIaT1b_lkg5Bv3t8aLTPY-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    14240


    Wafer Sizes:

    Unknown


    Vintage:

    2006


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    No Configuration
    OEM Model Description
    Grinder + CMP stress release High through put wafer handling 15umt wafer thickness in mass producing. The RM200/300 offers a single-unit solution supplementing PG200/300 processing with additional functionality to remove protective tape from thinner wafers and apply wafers to dicing frames. Performs the processes of the rough grinding, fine grinding, polishing and cleaning wafers on the both sides in a single machine. All the processes are completed without moving the wafer on the same chuck table.
    Documents

    No documents

    Similar Listings
    View All
    ACCRETECH / TSK PG300RM
    ACCRETECH / TSK
    PG300RM
    Polishing and GrindingVintage: 0Condition: UsedLast Verified: Over 60 days ago
    ACCRETECH / TSK PG300RM
    ACCRETECH / TSK
    PG300RM
    Polishing and GrindingVintage: 2006Condition: UsedLast Verified: Over 60 days ago
    ACCRETECH / TSK PG300RM
    ACCRETECH / TSK
    PG300RM
    Polishing and GrindingVintage: 2007Condition: UsedLast Verified: Over 30 days ago