W-GM-4250
Category
Lapping, Polishing, GrindingOverview
W-GM-4250 is a Wafer Edge Grinding Machine from the W-GM series by TOSEI ENGINEERING CORP. It has 2 grinding stages with a 4-cassette loader and is capable of grinding various materials such as Silicon, Sapphire and compound materials such as SiC. It is designed for easy operation by touch screen and graphical user interface. The W-GM-4250 is part of the W-GM-4200 Series and is designed for 2" to 8" wafer production.
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7
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ACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: Condition: UsedLast VerifiedOver 60 days agoACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: 2017Condition: UsedLast VerifiedYesterdayACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: 2012Condition: UsedLast VerifiedYesterday
ACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: 2014Condition: UsedLast VerifiedYesterdayACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: 2018Condition: UsedLast VerifiedYesterdayACCRETECH / TOSEI
W-GM-4250
Lapping, Polishing, GrindingVintage: 2014Condition: UsedLast VerifiedYesterday