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Description
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8+3+TRAY 510*460mmOEM Model Description
CM-602L, a highly versatile and efficient pick-and-place machine that revolutionizes electronics assembly. With abundant variations to choose from, tailor the machine to your specific product and production volume, accommodating everything from small chips to odd-shaped parts. The high-speed 12-nozzle head expands the parts range by an impressive 2.4 times, enabling lightning-fast placement of even □12 mm parts. Additionally, the general-purpose 8-nozzle head boasts enhanced abilities to handle odd-shaped components and supports 3D sensor integration and direct tray feeding. Experience improved area productivity with a downsized trolley and an optimized mounting sequence, boosting actual productivity by 8%. With high-speed detection using a 3D sensor and part thickness sensor, achieve top-notch quality during batch scanning of IC parts. The CM-602L's general-purpose transfer unit for POP and C4 mounting ensures accurate and efficient transfer of solder and flux. Enjoy seamless model switching and excellent compatibility with the CM402 series due to its innovative module design concept. Enhance your electronics manufacturing with the CM-602L, the epitome of precision, speed, and versatility.Documents
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Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80535
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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PANASONIC
CM602-L
CATEGORY
Pick and Place
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
80535
Wafer Sizes:
Unknown
Vintage:
2008
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
8+3+TRAY 510*460mmOEM Model Description
CM-602L, a highly versatile and efficient pick-and-place machine that revolutionizes electronics assembly. With abundant variations to choose from, tailor the machine to your specific product and production volume, accommodating everything from small chips to odd-shaped parts. The high-speed 12-nozzle head expands the parts range by an impressive 2.4 times, enabling lightning-fast placement of even □12 mm parts. Additionally, the general-purpose 8-nozzle head boasts enhanced abilities to handle odd-shaped components and supports 3D sensor integration and direct tray feeding. Experience improved area productivity with a downsized trolley and an optimized mounting sequence, boosting actual productivity by 8%. With high-speed detection using a 3D sensor and part thickness sensor, achieve top-notch quality during batch scanning of IC parts. The CM-602L's general-purpose transfer unit for POP and C4 mounting ensures accurate and efficient transfer of solder and flux. Enjoy seamless model switching and excellent compatibility with the CM402 series due to its innovative module design concept. Enhance your electronics manufacturing with the CM-602L, the epitome of precision, speed, and versatility.Documents
No documents