Veeco Instruments Inc. a global leader of advanced thin film etch and deposition process equipment, acquired Ultratech, Inc. a leading supplier of lithography, laser-processing and inspection systems used to manufacture semiconductor devices and LEDs.


The UltraStep 1500 is a big field 1:1 projection stepper system that exposes reticle images onto wafers of various sizes in a step-and-repeat manner. It has a fine line resolution of 1.0um standard and 0.8um optional, and tight overlay accuracy. The UltraStep 1500 features a larger exposure field, an electronic focus system, electronic target detectors, 944 servo boards, and a cast illuminator with upgraded optics. These features allow for large die exposure, increased throughput, more accurate and repeatable substrate positioning, simultaneous independent target scans, more stability during movement and exposure, and lower exposure field uniformity. The UltraStep 1500’s low cost and compact design make it an ideal choice for chipmakers upgrading from older equipment, and it can be integrated with other higher resolution steppers to maximize throughput while minimizing production costs.

VEECO / ULTRATECH

1500

The Ultratech Saturn Spectrum 3e is a lithography stepper from Ultratech Stepper Inc. that is designed for high-volume flip-chip (bump) and wafer-level packaging manufacturing. It features an improved machine vision system (MVS) with the addition of the PatMAX architecture, which is a pattern recognition-based alignment system that eliminates the need for dedicated targets and simplifies integration with existing processes. The Saturn Spectrum 3e also has improved illumination, providing an increased wafer plane irradiance of 1900 mW/cm2, resulting in decreased exposure times and improved productivity. Additionally, the tool incorporates an automated field aperture changer to enable faster reticle field size changes, as well as an automated broadband ghi-line filter changer, allowing automated switching between either g, h or i-line exposure capabilities. 

SATURN SPECTRUM 3e

The model 2244i and Saturn Wafer Stepper feature an i-line illumination specification that is designed to make them compatible with advanced i-line reduction steppers.

2244i

The UltraTech Saturn Spectrum 300 is a stepper system used in the fabrication of semiconductors. It can handle wafers that are between 8" and 12" in size and has a resolution of 2.0 microns. The system is equipped with a robotic wafer handler, an environmental chamber, and a reticle library, as well as a light pipe that measures 44 x 26.7 mm. The illuminator can be either 1000w or 1200w and the lens alignment is automatic with enhanced global alignment. Additionally, the UltraTech Saturn Spectrum 300 features an air probe focus detector, a 3-point focus detector, and a linear motor for the X and Y stage. It also includes an MVS pattern recognition system, a closed-loop exposure dose controller, a vibration isolation system, auto-uniformity, and dynamic focus. The system is SECS II compatible and has bottom-side prism protection pellicle, dual flip aperture broadband, an intensity of 1650mW, uniformity of 7%, and a DOF of 2µm.

SATURN SPECTRUM 300

The 4700 model provides manufacturers the ability to print rowbars with a single exposure. This process enhances both yields and magnetic recording head performance. Rowbars are structures in read/write heads of hard drives. The ability to print these with a single exposure can significantly speed up the manufacturing process and improve the quality of the end product. This model represent advanced tools in the field of semiconductor and microdevice manufacturing, offering increased efficiency and precision. This is used in industries where microfabrication is key, such as in the production of microprocessors, memory chips, and hard drives.

4700

The Ultratech Saturn Spectrum 3 is a stepper and scanner system utilized in the production of semiconductor devices. It is capable of manufacturing wafers in sizes ranging from 4 to 8 inches. Ultratech also offers an updated version of this system, the Saturn Spectrum 3e, which incorporates an enhanced machine vision system (MVS) that includes the PatMAX architecture. The Saturn Spectrum 3e also boasts improved illumination, with a wafer plane irradiance of 1900 mW/cm2, resulting in shorter exposure times.

SATURN SPECTRUM 3

CGS-300

1000

The UltraTech 1100 is a stepper system that is used to transfer reticle images onto wafers. It can handle wafers that are between 3" and 6" in size and has a resolution of 1.0 microns. The system uses a broadband alignment system that includes both “G” and “H” lines and has the option for either WAS key and target automation or an intelligent autoloader. Additionally, the UltraTech 1100 features air probe edge switches and is equipped with an HP 362 computer that includes a hard disk. 

1100

Ultratech Stepper Inc. has launched the Model 1500MVS, the latest addition to its well-established Model 1500 Lithography Series. The Model 1500MVS incorporates Ultratech’s machine vision system (MVS), which provides enhanced alignment flexibility that is not achievable using traditional alignment methods. As a pattern recognition alignment system, the MVS eliminates the need for larger scribe lines between dies to accommodate dedicated alignment targets, resulting in an increase in the number of net die-per-wafer. According to Ultratech, the Model 1500’s MVS capability enables it to recognize targets produced for any other lithography tool, thereby eliminating the need for dedicated targets and facilitating the implementation of mix-and-match strategies.


1500 MVS

The Prisma-ghi was developed as a lower cost, low volume/R&D bump stepper.

PRISMA-ghi

The XLS 193nm (small field) system is a DUV tool used for advanced research and development semiconductor materials and processes.

XLS 193nm

The Saturn Spectrum 300e2 is a flagship product from the Saturn company that supports 300mm bump manufacturing. It provides broadband exposure (g, h, and i-line) and is used in conjunction with electroplating to produce a pattern of bumps or metal connections on the bond pads of the die for flip chip devices. This technology is essential for creating high-quality and reliable connections in electronic devices. 

SATURN SPECTRUM 300e2

1100R

1100S

SATURN 300

SATURN III

TITAN 200

The ULTRATECH Saturn Spectrum 300E is a type of stepper developed by Ultratech Stepper Inc. to meet the increasing demand for thick photoresist exposure in 300mm bump applications. It is part of Ultratech’s advanced-packaging product line. The Saturn Spectrum 300E is designed to provide consistent exposure doses on wafer substrates, resulting in faster production times and fewer issues with non-scalable patterns. Its low numerical aperture (NA) and broadband illumination spectrum allow for a more uniform aerial image through the depth of ultra-thick photosensitive materials, compared to steppers with higher NAs and narrower bandwidths.

SATURN SPECTRUM 300e

TITAN 4700

The Saturn or Titan stepper is used in conjunction with electroplating to produce a pattern of bumps, or metal connections, on the bond pads of the die for flip chip devices.

SATURN I

TITAN 1.1

TITAN 300

TITAN 1.2

SATURN II

The XLS 9800 and XLS 9900 provide i-line and DUV wavelength capabilities and are designed to meet TFH customers' requirements for shrinking geometries on their critical layers.

XLS 9800

TITAN 4035

1000W

The Ultratech Star 100 is a type of 1X stepper that provides improved alignment for device features that are larger than 0.8 micrometers. It is intended to replace contract printers and other systems by offering better alignment capabilities and more advanced networking features. The Star 100 can handle wafers that range in size from 75 millimeters to 200 millimeters, and it is marketed as an affordable lithography solution for high-volume fabs that produce low-cost power ICs, linear chips, and application-specific ICs. The system is based on Ultratech’s 1500 stepper platform and uses a cutting-edge machine vision system (MVS) for pattern-recognition alignment. It also has a new PC-based system controller and operator interface. The MVS alignment system includes new software that allows it to align to difficult product layers, eliminating the need for large scribe lines.

VEECO / ULTRATECH

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