Description
HDD includedConfiguration
3CHOEM Model Description
The Applied Producer Celera PECVD system offers industry-standard tunable compressive and tensile high-stress silicon nitride films for strain engineering applications at advanced nodes. The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low thermal budget requirements. The same chamber can deposit films with compressive stresses up to 3.5 GPa with extended RF capability. The process utilizes production-proven silane CVD technology to deliver superior step coverage (70%) and high-quality film with low hydrogen content while retaining excellent SiN etch-stop properties and pattern-loading results. The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform with its flexible Twin Chamber® configuration and platform extendibility that enables customers to leverage the Producer toolset for multiple process nodes.Documents
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CATEGORY
PECVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127121
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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APPLIED MATERIALS (AMAT)
PRODUCER GT CELERA
CATEGORY
PECVD
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
127121
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
HDD includedConfiguration
3CHOEM Model Description
The Applied Producer Celera PECVD system offers industry-standard tunable compressive and tensile high-stress silicon nitride films for strain engineering applications at advanced nodes. The system offers an integrated stress nitride deposition and UV cure that delivers tensile stress of up to 1.7GPa, while meeting low thermal budget requirements. The same chamber can deposit films with compressive stresses up to 3.5 GPa with extended RF capability. The process utilizes production-proven silane CVD technology to deliver superior step coverage (70%) and high-quality film with low hydrogen content while retaining excellent SiN etch-stop properties and pattern-loading results. The Applied Celera deposition and UV cure processes are integrated on the production-proven, high-throughput Producer platform with its flexible Twin Chamber® configuration and platform extendibility that enables customers to leverage the Producer toolset for multiple process nodes.Documents
No documents