
Description
Number of Chambers 3 (A, B, C, D): 3(A, B, C) Load Locks LL1, LL2: LL1, LL2 Transfer Chamber: Vacuum Robot Process Chambers eXT Metal Etch Chambers: eXT Metal Cu Etch RF Generator: 13.56 MHz / Bias RF Vacuum: Pump Turbo ESC Type: Electrostatic Chuck Temperature: Backside He Cooling Endpoint Detection: Optical Emission Spectroscopy (if equipped) Factory Interface: EFEM + FOUP Load Ports Communications: SECS/GEM, GEM300 Utilities CDA, N₂, Process Gas, Cooling Water, Vacuum Safety Systems: Gas Monitoring, Interlocks, EMO Chamber Process PM1: Metal Main Etch PM2: Metal Main Etch PM3: Metal Main Etch Chillers: Nil Does not include: Dry pumps, Chillers, HDD.Configuration
Process Type: Metal Cu Etch Software Version: -OEM Model Description
None ProvidedDocuments
CATEGORY
PECVD
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154327
Wafer Sizes:
12"/300mm
Vintage:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllAPPLIED MATERIALS (AMAT)
PRODUCER EXT
CATEGORY
PECVD
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
154327
Wafer Sizes:
12"/300mm
Vintage:
2016
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available