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APPLIED MATERIALS (AMAT) CENTURA 5200 DXZ
  • APPLIED MATERIALS (AMAT) CENTURA 5200 DXZ
  • APPLIED MATERIALS (AMAT) CENTURA 5200 DXZ
  • APPLIED MATERIALS (AMAT) CENTURA 5200 DXZ
Description
No description
Configuration
3 DxZ Chambers w/ RPS
OEM Model Description
The Centura 5200 DXZ is used for advanced 150mm and 200mm CVD technology in the advanced CMOS and MtM segments. It can be used for ultra-thick oxides (≥20µm), low-temperature processing (<200°C), conformal, low wet-etch-rate films, and doped films with tunable refractive indices. The system can handle a variety of MtM substrates (including SiC wafers) reliably and carefully from load lock wafer mapping to clear wafer orientation to wafer placement.
Documents

No documents

CATEGORY
PECVD

Last Verified: Over 60 days ago

Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

15128


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available

APPLIED MATERIALS (AMAT)

CENTURA 5200 DXZ

verified-listing-icon
Verified
CATEGORY
PECVD
Last Verified: Over 60 days ago
listing-photo-C5CU38jO5wPozNn99-LWlUkMLFwhi3yZJdPArlwWR-Y-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
Key Item Details

Condition:

Used


Operational Status:

Unknown


Product ID:

15128


Wafer Sizes:

8"/200mm


Vintage:

Unknown


Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No description
Configuration
3 DxZ Chambers w/ RPS
OEM Model Description
The Centura 5200 DXZ is used for advanced 150mm and 200mm CVD technology in the advanced CMOS and MtM segments. It can be used for ultra-thick oxides (≥20µm), low-temperature processing (<200°C), conformal, low wet-etch-rate films, and doped films with tunable refractive indices. The system can handle a variety of MtM substrates (including SiC wafers) reliably and carefully from load lock wafer mapping to clear wafer orientation to wafer placement.
Documents

No documents