APPLIED MATERIALS (AMAT) / APPLIED KOMATSU TECH (AKT) 1600 PECVD

Description

The current setup is 5 x PECVD, like on the AMAT Centura platform it’s possible to make it a PECVD/Etch system just remove one PECVD chamber and at a Etch chamber to the empty position. The mainframe can hold maximum 5 chambers that’s why you have to remove one chamber.

Configuration

Process: PECVD iN,SiO2, i-a-Si, SiON and N+ a-Si • SoFware Version: AKT7.3 • System Power RaNng: 208 VAC 3-Phase • Flat panel size: 320 x 352 mm • (5) Process chambers: • Film Capability SiN • SiO2 • i-a-Si • SiON • N+ a-Si (Remote Plasma Clean) Includes: • Chillers • Full set of manuals

OEM Model Description

The Applied Materials AKT1600 is a panel etcher and panel deposition tool with four loading ports, two vacuum load locks, and five chambers. Two chambers (A and B) are designated for etching, processing a maximum of two panels at a time. Etch Chamber A is used primarily for etching silicon nitrate (SiN) while Etch Chamber B is used to etch aluminum (Al), molybdenum (Mo), indium tin oxide (ITO) and amorphous silicon (a-Si). The three deposition chambers are single panel chambers. Chamber D is used to deposit SiN and a-Si. Chamber C is used to deposit material doped n-type and chamber E to deposit materials doped p-type although both chambers can also deposit un-doped amorphous silicon. The AKT 1600 plasma enhanced chemical vapor deposition (PECVD) system is a powerful vacuum system used to convert reactive gaseous species into a solid film. With its advanced capabilities and versatility, the AKT 1600 PECVD system is an essential tool for the fabrication of high-quality solar cells.