Description
Manual MounterConfiguration
No ConfigurationOEM Model Description
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.Documents
No documents
ULTRON SYSTEMS
UH114-8
Verified
CATEGORY
PCB / SMT
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79508
Wafer Sizes:
Unknown
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
ULTRON SYSTEMS
UH114-8
CATEGORY
PCB / SMT
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
79508
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Manual MounterConfiguration
No ConfigurationOEM Model Description
UH114-8 set the benchmark for control and versatility. For dicing/sawing applications, uniform adhesive plastic film lamination is paramount. The mounters feature an easily adjustable spring-loaded roller assembly, along with film tensioner bars along both the x- and y-axes to assure bubble-free lamination of the film to the wafer and film frame. In addition, both models feature a retractable film cutting system with adjustable cutting pressure to accommodate various tape base materials and thicknesses. Roller pressure is adjusted from the topside of the units for different process requirements and to accommodate various wafer thicknesses. A digital temperature controller assures consistent workstage temperatures for repeatable mounting. Adjustable alignment pins and vacuum cups accommodate almost any type of film frame, including plastic. The workstage height is also adjustable relative to the frame height for different wafer thicknesses.Documents
No documents