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LARSEN WAND
    Description
    Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air
    Configuration
    Singulation Process 3016AT
    OEM Model Description
    As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.
    Documents

    No documents

    LARSEN

    WAND

    verified-listing-icon

    Verified

    CATEGORY
    PCB / SMT

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    59322

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

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    LARSEN WAND

    LARSEN

    WAND

    PCB / SMT
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    LARSEN

    WAND

    verified-listing-icon
    Verified
    CATEGORY
    PCB / SMT
    Last Verified: Over 60 days ago
    listing-photo-58f46734f6284c29a4e35e67737a7cca-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    59322

    Wafer Sizes:

    Unknown

    Vintage:

    Unknown

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Depaneling system, 16" X 16" X 4.5" MAX, requires electricity and compressed air
    Configuration
    Singulation Process 3016AT
    OEM Model Description
    As an extension of our tooling expertise, Larsen builds an elite punch and die based depaneling system for the printed circuit board industry. By greatly reducing and eliminating any stress or flex during the separation process of multiple populated PCB’s, the WAND Depaneling System safeguards against fractured joints and excess burrs, and leaves disjointed arrays quickly and cleanly separated. The WAND System is perfectly suited to accommodate medium to high volume PCB separation needs.
    Documents

    No documents

    Similar Listings
    View All
    LARSEN WAND

    LARSEN

    WAND

    PCB / SMTVintage: 0Condition: UsedLast Verified: Over 60 days ago