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ASMPT / SIEMENS SIPLACE A2
    Description
    Pick small die (0.25 mm X 0.4mm) from 6" or 8" grip ring. Yes with small die kit (needle adapter) you can process these small chips (laser and vcsel done very often). Means additional conversion of the machine. But it's doable. Also pick small die from gelpak You need a gel pack workholder (extra in wafer table) functionality must be checked again, possibly vacuum hoses must be exchanged-repaired. In principle, the machine and software are prepared for this. What is gel pack size? 2" or 4"? Place into gelpaks or wafflepacks The machine is currently equipped with an automatic indexer for substrates or substrate carriers, the customer has to manufacture substrate carriers to hold the empty waffle packs or gel packs. If an automatic indexer is not desired or necessary, I recommend a hand indexer (to mount the mounting plate) and to change this to a hand with a waffle pack carrier for the empty waffle/gel packs.
    Configuration
    Siplace A2 Diebonder with two bondheads.
    OEM Model Description
    None Provided
    Documents

    No documents

    ASMPT / SIEMENS

    SIPLACE A2

    verified-listing-icon

    Verified

    CATEGORY
    PCB / SMT

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    60508


    Wafer Sizes:

    Unknown


    Vintage:

    2007

    Have Additional Questions?
    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
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    Refurbishment Services
    Available
    Similar Listings
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    ASMPT / SIEMENS SIPLACE A2

    ASMPT / SIEMENS

    SIPLACE A2

    PCB / SMT
    Vintage: 2007Condition: Refurbished
    Last VerifiedOver 60 days ago

    ASMPT / SIEMENS

    SIPLACE A2

    verified-listing-icon
    Verified
    CATEGORY
    PCB / SMT
    Last Verified: Over 60 days ago
    listing-photo-7da030cc549844f8ac589fb7362c8646-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/46493/7da030cc549844f8ac589fb7362c8646/746de41e84474f0881ced2cb5c1bfc59_7dffbaf2366b4b8ca5eeb7b4f856c36e1201a_mw.jpeg
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    Key Item Details

    Condition:

    Refurbished


    Operational Status:

    Unknown


    Product ID:

    60508


    Wafer Sizes:

    Unknown


    Vintage:

    2007


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Pick small die (0.25 mm X 0.4mm) from 6" or 8" grip ring. Yes with small die kit (needle adapter) you can process these small chips (laser and vcsel done very often). Means additional conversion of the machine. But it's doable. Also pick small die from gelpak You need a gel pack workholder (extra in wafer table) functionality must be checked again, possibly vacuum hoses must be exchanged-repaired. In principle, the machine and software are prepared for this. What is gel pack size? 2" or 4"? Place into gelpaks or wafflepacks The machine is currently equipped with an automatic indexer for substrates or substrate carriers, the customer has to manufacture substrate carriers to hold the empty waffle packs or gel packs. If an automatic indexer is not desired or necessary, I recommend a hand indexer (to mount the mounting plate) and to change this to a hand with a waffle pack carrier for the empty waffle/gel packs.
    Configuration
    Siplace A2 Diebonder with two bondheads.
    OEM Model Description
    None Provided
    Documents

    No documents

    Similar Listings
    View All
    ASMPT / SIEMENS SIPLACE A2

    ASMPT / SIEMENS

    SIPLACE A2

    PCB / SMTVintage: 2007Condition: RefurbishedLast Verified: Over 60 days ago