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ASMPT / DEK E by DEK
    Description
    No description
    Configuration
    Machine Alignment Capablllty: >2.0 Cmk@ ±12.5um (±6 Sigma) Core Cycle Time: 10s Product Changeover <2 minutes New Product Setup<10 minutes Printer Construction: One piece optimised welded frame ISCAN Machine Control: Motion control using CAN BUS network Motion: Rotary motors and encoders, with 4 micron resolution Operating System: Windows Embedded Standard 7 Squeegee Pressure Mechanism: Software controlled, motorised with closed loop feedback Stencil Frame Size (maximum): 736mm x 736mm Under Stencil Cleaning: 300/400/520mm Interchangeable Under Stencil
    OEM Model Description
    Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)* Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)** Shortest core cycle time (CCT): 11 seconds (8 seconds with option) Operating system: Windows 7 Standard embedded Squeegee pressure: Software-controlled, motorized with closed-loop feedback Stencil positioning: Depth stop or semi-automatic stencil loading Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y) Substrate thickness: 0.2 mm to 6 mm Substrate weight: Up to 6 kg Program creation: Less than 10 minutes Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional) Temperature and humidity sensors: Statistical recording of temperature and humidity readings Paste verification: Hawkeye 750 (optional)
    Documents

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    ASMPT / DEK

    E by DEK

    verified-listing-icon

    Verified

    CATEGORY
    PCB / SMT

    Last Verified: Over 60 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    73884


    Wafer Sizes:

    Unknown


    Vintage:

    2019

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    Transaction Insured by Moov
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    Similar Listings
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    ASMPT / DEK E by DEK

    ASMPT / DEK

    E by DEK

    PCB / SMT
    Vintage: 0Condition: Used
    Last VerifiedOver 60 days ago

    ASMPT / DEK

    E by DEK

    verified-listing-icon
    Verified
    CATEGORY
    PCB / SMT
    Last Verified: Over 60 days ago
    listing-photo-b7d78287696f46208e1e8bea74708850-https://d2pkkbyngq3xpw.cloudfront.net/moov_media/3.0-assets/photo-coming-soon-small.png
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    73884


    Wafer Sizes:

    Unknown


    Vintage:

    2019


    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Machine Alignment Capablllty: >2.0 Cmk@ ±12.5um (±6 Sigma) Core Cycle Time: 10s Product Changeover <2 minutes New Product Setup<10 minutes Printer Construction: One piece optimised welded frame ISCAN Machine Control: Motion control using CAN BUS network Motion: Rotary motors and encoders, with 4 micron resolution Operating System: Windows Embedded Standard 7 Squeegee Pressure Mechanism: Software controlled, motorised with closed loop feedback Stencil Frame Size (maximum): 736mm x 736mm Under Stencil Cleaning: 300/400/520mm Interchangeable Under Stencil
    OEM Model Description
    Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)* Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)** Shortest core cycle time (CCT): 11 seconds (8 seconds with option) Operating system: Windows 7 Standard embedded Squeegee pressure: Software-controlled, motorized with closed-loop feedback Stencil positioning: Depth stop or semi-automatic stencil loading Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y) Substrate thickness: 0.2 mm to 6 mm Substrate weight: Up to 6 kg Program creation: Less than 10 minutes Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional) Temperature and humidity sensors: Statistical recording of temperature and humidity readings Paste verification: Hawkeye 750 (optional)
    Documents

    No documents

    Similar Listings
    View All
    ASMPT / DEK E by DEK

    ASMPT / DEK

    E by DEK

    PCB / SMTVintage: 0Condition: UsedLast Verified: Over 60 days ago
    ASMPT / DEK E by DEK

    ASMPT / DEK

    E by DEK

    PCB / SMTVintage: 2019Condition: UsedLast Verified: Over 60 days ago