Description
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Machine Alignment Capablllty: >2.0 Cmk@ ±12.5um (±6 Sigma) Core Cycle Time: 10s Product Changeover <2 minutes New Product Setup<10 minutes Printer Construction: One piece optimised welded frame ISCAN Machine Control: Motion control using CAN BUS network Motion: Rotary motors and encoders, with 4 micron resolution Operating System: Windows Embedded Standard 7 Squeegee Pressure Mechanism: Software controlled, motorised with closed loop feedback Stencil Frame Size (maximum): 736mm x 736mm Under Stencil Cleaning: 300/400/520mm Interchangeable Under StencilOEM Model Description
Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)* Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)** Shortest core cycle time (CCT): 11 seconds (8 seconds with option) Operating system: Windows 7 Standard embedded Squeegee pressure: Software-controlled, motorized with closed-loop feedback Stencil positioning: Depth stop or semi-automatic stencil loading Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y) Substrate thickness: 0.2 mm to 6 mm Substrate weight: Up to 6 kg Program creation: Less than 10 minutes Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional) Temperature and humidity sensors: Statistical recording of temperature and humidity readings Paste verification: Hawkeye 750 (optional)Documents
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ASMPT / DEK
E by DEK
Verified
CATEGORY
PCB / SMT
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73884
Wafer Sizes:
Unknown
Vintage:
2019
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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View AllASMPT / DEK
E by DEK
CATEGORY
PCB / SMT
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
73884
Wafer Sizes:
Unknown
Vintage:
2019
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
Machine Alignment Capablllty: >2.0 Cmk@ ±12.5um (±6 Sigma) Core Cycle Time: 10s Product Changeover <2 minutes New Product Setup<10 minutes Printer Construction: One piece optimised welded frame ISCAN Machine Control: Motion control using CAN BUS network Motion: Rotary motors and encoders, with 4 micron resolution Operating System: Windows Embedded Standard 7 Squeegee Pressure Mechanism: Software controlled, motorised with closed loop feedback Stencil Frame Size (maximum): 736mm x 736mm Under Stencil Cleaning: 300/400/520mm Interchangeable Under StencilOEM Model Description
Alignment accuracy: > 2.0 Cmk @ ±12.5 μm, (6 sigma)* Machine capability: > 2.0 Cmk @ ±25 μm, (6 sigma)** Shortest core cycle time (CCT): 11 seconds (8 seconds with option) Operating system: Windows 7 Standard embedded Squeegee pressure: Software-controlled, motorized with closed-loop feedback Stencil positioning: Depth stop or semi-automatic stencil loading Adjustable-width stencil mount: Variable stencil width adjustment for frame sizes ranging from 381 mm to 736 mm and thicknesses ranging from 25 mm to 38 mm Understencil cleaning: DEK Interchangeable Under Stencil Cleaner (DEK IUSC) with programmable wet, dry and vacuum cleaning Substrate size: 50 mm (X) x 40.5 mm (Y) to 510 mm (X) x 508.5 mm (Y) Substrate thickness: 0.2 mm to 6 mm Substrate weight: Up to 6 kg Program creation: Less than 10 minutes Substrate clamping: Over-the-top clamping, Edge clamping (optional), Vacuum (optional) Temperature and humidity sensors: Statistical recording of temperature and humidity readings Paste verification: Hawkeye 750 (optional)Documents
No documents