Description
Pasting machineConfiguration
No ConfigurationOEM Model Description
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.Documents
No documents
TEIKOKU
ATM-800X
Verified
CATEGORY
Packaging
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94157
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
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TEIKOKU
ATM-800X
CATEGORY
Packaging
Last Verified: 2 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
94157
Wafer Sizes:
Unknown
Vintage:
2004
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Pasting machineConfiguration
No ConfigurationOEM Model Description
-Handles wafer diameters up to 200mm(8 inch) -H.D.C.R(Highly Digital Control Recipe) Availlable -Running Thin Wafer/ High Bump Wafer Capabity . -The New Wafer Mounter orients a wafer on a dicing frame automatically. -A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer. -This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.Documents
No documents
Similar Listings
View AllNo Similar Listings