-Handles wafer diameters up to 200mm(8 inch)
-H.D.C.R(Highly Digital Control Recipe) Availlable
-Running Thin Wafer/ High Bump Wafer Capabity .
-The New Wafer Mounter orients a wafer on a dicing frame automatically.
-A wafer is fed from the loading cassette, positioned with respect to X/Y and θ. (theta) on the alignment table, and then located on the wafer stage. During this process, the wafer front side does not contact with the patented wafer table except for the periphery edge of the wafer.
-This unique patented non-contact wafer table improves the yield and reduces the amount of tape used. Wafer and frame are mounted by adhesive tape. and a patented round roller cutter assures a clean. uniform edge and safe cut. The wafer mounter has an X-Y and sheathed alignment process, and applicable to wafer size 8", 6", 5" and 4" as well.

TEIKOKU

ATM-800X

EXL-1200F2	

EXL-1200HS-F2-BL	

EXR-1200FMUV	

EXL-1200HSF1	

DXL 800HS

DXL2-800CS-LSR-BMP-CE

ATM-860X

800CS

DXR2-800CS-CE

DXL 800MKII

DXR 800CS

DXL2-800HS-LSR-BMP-CE-V1

STM-800X

EXR-1200F2-CE

800HS

DXR2-800CS-CE-V1

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ATM-800X

EXL-1200F2

EXR-1200FMUV

EXL-1200HSF1

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