Description
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<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM Model Description
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TEIKOKU
DXL 800HS
Verified
CATEGORY
Packaging
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17902
Wafer Sizes:
8"/200mm
Vintage:
Unknown
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Logistics Support
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Transaction Insured by Moov
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Refurbishment Services
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TEIKOKU
DXL 800HS
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
17902
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
<b>DXL2-800HS-BL-CE Characteristic :</b> Handles wafer diameters up to 200mm(8 inch) Advanced Stainless Porous Vacuum Chuck will support up to 98% of the wafer area and highly secured and protect wafer during the tape removal. H.D.C.R(Highly Digital Control Recipe) Availlable. TTS Unique Inline UV Technology and Longer UV Lamp lifetime. Running Ultra Thin Wafer/ High Bump Wafer Capabity. High Power Multi Wave UV Irradiator.(OPTION)OEM Model Description
LASERDocuments
No documents
Similar Listings
View AllNo Similar Listings