Description
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With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM Model Description
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.Documents
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NITTO
DR8500III
Verified
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65683
Wafer Sizes:
Unknown
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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NITTO
DR8500III
CATEGORY
Packaging
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
65683
Wafer Sizes:
Unknown
Vintage:
2017
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
With Touch Panel CE mark SECS/GEM WPH : 65 PcsFully automated tape laminator MSA840VIII Semi auto vacuum mounter Tape: PW3615MT Cutter temperature: 120°C Table temperature: 90°C Roller temperature: 60°C Lamination speed: 10 to 2 mm / sec (Changed motor gear to low) Lamination pressure: 0.3 to 0.5 MPa (Dual press roller) Pre heat: 100°C, 5 min Heat up on hot plate: 200°C, 10 min Taper, 4"-8" Power supply: 110 V.OEM Model Description
This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.Documents
No documents