The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an option

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HR 8500 II

MA 3000 II

This equipment applies protection tape on the wafer patterned surface for the back-grinding process. Full-auto type & Semi-auto type machines are lined up, and large size wafers are also available.

DR8500III

UM 810

MA 1508N

M286N

MSA 840

 The DR8500-II, a fully automatic system capable of handling up to 8" wafers. This advanced equipment features a robot arm for seamless wafer transfer and a CCD type non-contact aligner, ensuring precise wafer alignment without any risk of dust contamination.

DR8500 II

DSA 840

HSA 840

DR 3000 II

TL-1	

PL55TRM-LF

MA 3000 III

Tape Applicator for wafers up to 12". This taping system automates the application of protection tape on the surface of the semiconductor wafer during backgrinding.

DR 3000III

MSA 840 II

HR 8500

HMT 840

UA 3000II

Tape Remover for wafers up to 8". This taping system automates the removal of the protection tape after backgrinding.

HR 8500 III

DR8500

Tape Remover for wafers up to 12". This taping system automates the removal of the protection tape after backgrinding.

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HR 8500 II

MA 3000 II

DR8500III

UM 810

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