Description
De-Taping L*W*H (cm) -120x130x160 �Weight (kg) -� 1000 1. No Ecim function 2. Cannot support 12" wafer RFID Display is not includedConfiguration
No ConfigurationOEM Model Description
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an optionDocuments
No documents
Verified
CATEGORY
Packaging
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143429
Wafer Sizes:
Unknown
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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HR 8500 II
CATEGORY
Packaging
Last Verified: 9 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
143429
Wafer Sizes:
Unknown
Vintage:
1998
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
De-Taping L*W*H (cm) -120x130x160 �Weight (kg) -� 1000 1. No Ecim function 2. Cannot support 12" wafer RFID Display is not includedConfiguration
No ConfigurationOEM Model Description
The HR-8500-II is a fully automatic type that can handle wafers up to 8". Equipped with a robot arm for wafer transfer and a CCD type non-contact aligner for wafer alignment, transferring wafers without generating dust. Easy operation is possible with a touch panel. Transfers large diameter wafers without generating dust. An ultraviolet irradiation device can be installed as an optionDocuments
No documents