Description

Taping L*W*H (cm) -120x130x160 �Weight (kg) -� 1000 1. No Ecim function 2. Cannot support 12" wafer RFID Display is not included

Configuration

No Configuration

OEM Model Description

The DR8500-II, a fully automatic system capable of handling up to 8" wafers. This advanced equipment features a robot arm for seamless wafer transfer and a CCD type non-contact aligner, ensuring precise wafer alignment without any risk of dust contamination.