Description
VACUUM ASSISTED 3 PRESS TRANSFER MOLDConfiguration
AMS-LM 306OEM Model Description
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.Documents
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BESI / FICO
AMS-LM
Verified
CATEGORY
Packaging
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102516
Wafer Sizes:
Unknown
Vintage:
Unknown
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Logistics Support
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Money Back Guarantee
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Transaction Insured by Moov
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Refurbishment Services
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BESI / FICO
AMS-LM
CATEGORY
Packaging
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
102516
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
VACUUM ASSISTED 3 PRESS TRANSFER MOLDConfiguration
AMS-LM 306OEM Model Description
Molding is a process where micro chips are encapsulated in plastic. In line with the market trend toward SIP, exposed dies and more complex packages like dual side molding, Besi developed the large substrate molding machine Fico AMS-LM. The Fico AMS-LM can handle substrates of up to 102 x 280mm and can handle all current single and dual sided packages. Large substrates allow a high board utilisation and in combination with deep vacuum, the unique clamp mechanism and the high output of the Fico AMS-LM, performance and yield increase significantly.Documents
No documents