Description
No descriptionConfiguration
- Wafer Type: 11x4”, 6x6”, 3x8” GaN on Silicon/SiC - Transfer Module: able to support up to 4 chambers - Pump: Edwards iXH645H - Chiller: SMC - MFCs Type: Horiba - MO Configuration: TMGa1/2, TMAl1/2, TEGa, Cp2Fe, TMIn, Cp2Mg - Doping Source: 2x External Dopant inlet - Inline Purifiers: H2, N2, NH3 - Dew Point Sensor: H2, N2OEM Model Description
MOCVD system for production of GaN power devicesDocuments
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ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA (AMEC)
Prismo PD5
Verified
CATEGORY
MOCVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
96275
Wafer Sizes:
Unknown
Vintage:
2020
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
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ADVANCED MICRO-FABRICATION EQUIPMENT INC. CHINA (AMEC)
Prismo PD5
CATEGORY
MOCVD
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
96275
Wafer Sizes:
Unknown
Vintage:
2020
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
- Wafer Type: 11x4”, 6x6”, 3x8” GaN on Silicon/SiC - Transfer Module: able to support up to 4 chambers - Pump: Edwards iXH645H - Chiller: SMC - MFCs Type: Horiba - MO Configuration: TMGa1/2, TMAl1/2, TEGa, Cp2Fe, TMIn, Cp2Mg - Doping Source: 2x External Dopant inlet - Inline Purifiers: H2, N2, NH3 - Dew Point Sensor: H2, N2OEM Model Description
MOCVD system for production of GaN power devicesDocuments
No documents