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The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.Documents
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
Verified
CATEGORY
Microscope
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69578
Wafer Sizes:
Unknown
Vintage:
Unknown
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THERMOFISHER SCIENTIFIC / FEI / PHILLIPS
HELIOS NANOLAB 600
CATEGORY
Microscope
Last Verified: Over 30 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
69578
Wafer Sizes:
Unknown
Vintage:
Unknown
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The Helios NanoLab 600 is a Dual Beam FIB/SEM (Focused Ion Beam/Scanning Electron Microscope) that is designed for high-end imaging during failure analysis. It features an extreme high-resolution column, a fine-probe ion source, and a 150 x 150 mm, five-axis, XY piezo stage. This makes it a smart investment for failure-analysis labs that require versatile sample handling, from packaged parts to eight-inch wafers. The Helios NanoLab 600 is particularly useful for cross-sectioning samples and delivers three-dimensional imaging, allowing you to quickly and efficiently locate and view device features from different angles. Additionally, patented beam chemistries can be used to highlight interface layers for imaging in the system, providing you with the most accurate data possible without additional preparation steps outside the system.Documents
No documents