
Description
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensorConfiguration
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM Model Description
None ProvidedDocuments
No documents
CATEGORY
Metrology
Last Verified: 11 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147462
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
UNITY SEMICONDUCTOR / HSEB
Lightspeed
CATEGORY
Metrology
Last Verified: 11 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
147462
Wafer Sizes:
8"/200mm
Vintage:
2022
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
LightSPEED "Standard" (200mm compliant) Dark Field & Doppler detection capability Sensitivity down to 50nm on Si Transparent and opaque wafers Automated Defect Classification (ADC) Standard result file generation FFU on module Throughput • High Sensitivity Mode : 25 wafers per hour High ThroughtPut Mode: 70 wafers per hour EFEM two Loadports with vacuum handling EFEM two load ports SMIF pod 200mm compliant Light tower 4 colors Wafer ID reader (Backside) FFU on EFEM Integration of RFID reader for SMIF pod TAG (design and material provided by OSRAM) Factory Automation: Including SECS/GEM, compatible with ATV (E84 compliant with exception of PIO sensorConfiguration
Application: Frontside Unpattern inspection 2 GaAs (thickness 675 um) Sapphire (thickness 600-2000 um) SiliconOEM Model Description
None ProvidedDocuments
No documents