Onto Innovation is a worldwide leader in the design, development, manufacture and support of process control tools that perform macro defect inspections and metrology, lithography systems, and process control analytical software used by semiconductor wafer and advanced packaging device manufacturers. 

ONTO / RUDOLPH / AUGUST

MetaPULSE XCu

S3000

ASPECT is a metrology system designed for future memory architectures and scaling strategies, with the ability to handle memory stacks well over 200 pairs. It uses a revolutionary infrared optical system to provide full profiling capability, enabling critical etch and deposition control. The system is faster and has better process coverage than X-ray systems, making it ideal for applications such as etch, cleans, and deposition for Gen7 3D NAND and beyond, etch and implant for CIS and DRAM, and on-device materials characterization for advanced logic. Its superior performance has been demonstrated across multiple customer devices.

ASPECT

Picosecond ultrasonic technology, or PULSE™ technology, is the industry standard for metal film metrology. The Echo™ System is the latest addition to Onto Innovation's family of acoustic metrology products and is designed to extend the leadership across multiple leading-edge device segments. 

ECHO

These completely new second generation systems achieve higher throughput and better repeatability, especially when measuring copper interconnect structures in very low-k and ultra low-k interlevel dielectric.

MetaPULSE II-200

The SpectraLASER 200 XL is a product by Rudolph Technologies that provides repeatable t, n, and k measurements for semiconductor process control. It uses intense laser light for small-spot measurements on product wafers in various applications, including CMP, CVD, diffusion, lithography, and etch. The stable laser light output and long laser lifetimes (20-30,000 hours) ensure system-to-system matching and measurement stability. The product also features a deep UV reflectometer and simultaneous multiple angle of incidence data acquisition for optimum sensitivity. These capabilities allow the SpectraLASER 200 XL to characterize new semiconductor manufacturing processes and maintain control over them long term.

SpectraLASER 200 XL

MetaPULSE-II 300

The S3000SX thin film metrology system is for transparent films in advanced semiconductor fabrication applications at the 28nm node and below.

S3000SX

S3000UV

MetaPULSE 300 incorporates all of the features of our MetaPULSE 200 system and is configured to measure 300 millimeter product wafers.

MetaPULSE 300

Superior accuracy for transparent film measurements

S3000A

MetaPULSE 200 is the first production-worthy opaque film metrology tool that can simultaneously measure the individual thicknesses of up to six layers in a multi-layer metal (MLM) film stack. It can measure single or multi-layer thicknesses on product wafers with Angstrom accuracy and sub-Angstrom repeatability at up to 60 wafers per hour. The tool uses picosecond ultrasonic laser sonar (PULSE TechnologyTM), a non-contact, non-destructive measurement technique based on laser-induced ultrasound. Its pattern recognition allows it to reliably place its 10 µm measurement spot within existing metrology sites for reliable on-product measurement. MetaPULSE 200 can also diagnose film adhesion and interlayer-reaction problems, measure the RMS roughness of top- and buried-layers, and determine material properties such as silicide phase. This provides critical information about the product’s film stack, which is not available when using single-layer monitor wafer metrology. The system’s broad range of capabilities allows it to significantly reduce the use of monitor wafers in controlling cluster tool MLM deposition, leading to substantial cost and time savings.

MetaPULSE 200

MetaPULSE-III 300 XCu

MetaPULSE 300 XCu

S3000S

MetaPULSE 200 XCu

S300

The S200 is a metrology system designed by Rudolph to meet the challenges of high-yield semiconductor production at 0.18μm and below. It offers the industry’s highest repeatability laser-ellipsometer and a High Repeatability Mode (HRM™) for next-generation gates. The system has a 5x10μm measurement spot, the smallest in the industry, allowing for accurate measurements in test structures three times smaller than those required by other systems. Its unique simultaneous multiple angle of incidence ellipsometry provides accurate measurements, resulting in powerful multi-layer film characterization and superior process control. The S200 also has a high wafer-per-hour throughput, nearly twice that of competing ellipsometers, and long 20-30,000 hour laser lifetimes provide unparalleled system-to-system matching, superior repeatability, and significantly lower maintenance.

S200

Acoustic metrology and defect detection system.

SONUS 7800

MetaPULSE

MetaPULSE-III 300 is designed specifically to meet semiconductor manufacturers' metal thin-film metrology requirements at the 45 nm technology node and beyond. The modular design of the MetaPULSE-III offers Rudolph's patented PULSE Technology.

ONTO / RUDOLPH / AUGUST

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S3000

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SpectraLASER 200 XL

ASPECT

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