Overview

150/200mm bridge tool for Si, SiC, GaN, GaAs (on sapphire, SiC or Si), Ge and epitaxy processes. Automatic, non-contact measurement of filmed, patterned and bare wafers -150mm & 200mm diameter The MicroSense® CSW1 is formerly known as the UltraMap UMA-C200. The MicroSense CSW1 measurement system provides full wafer, high speed geometry measurement of semiconductor wafers using non-contact capacitance sensors with nanometer level thickness resolution. The system measures the thickness, flatness, bow and warp of the wafer in compliance with SEMI standards. Designed for maximum versatility, the system can measure 150mm and 200mm diameter wafers. Over 120,000 data are measured on each wafer to generate high resolution wafer maps.