The MicroSense® BP1 is formerly known as the UltraMap UMA-200-BP. The MicroSense BP1 wafer measurement system precisely measures wafer thickness, flatness and shape using two patented, noncontact, high resolution, auto-positioning back pressure probes. The BP1 is an extremely flexible system that can measure a wide range of wafer thicknesses and any wafer material. Wafer surface finish has no effect on the measurement – the BP1 measures sawn, lapped or polished wafers. 

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

BP1

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