Automated Wafer Thickness Measurement System
Cassette to cassette or manual loading. Exclusive sensing technology with dual White light chromatic coding probes (10nm resolution). High volume wafer production control, backgrinding control, Wafer characterization, extreme warp wafers, ultrathin wafers thickness mapping. 

Wafer 4” to 12” (100 to 300mm)

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

UltraMap-300

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