The Model 6033T, using ADE’s patented capacitive measurement principle, measures wafers for Thickness and Total Thickness Variation (TVV). Whenever semiconductor wafer inspection is required, the MicroSense Model 6033T offers a low cost method of achieving fast, accurate measurements on wafers up to 150mm in diameter. 

MicroSense has a singular focus on precision measurement. Provide customers with state-of-the-art measurement performance products - precision capacitive sensors for high resolution, non-contact position sensing; vibrating sample magnetometers and MOKE systems for magnetic property measurement; and wafer metrology systems for accurately measuring wafer thickness and shape.

6033T

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