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FOGALE Nanotech DEEPROBE 300-M
    Description
    No description
    Configuration
    Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance free
    OEM Model Description
    SEM / TEM / FIB
    Documents

    No documents

    FOGALE Nanotech

    DEEPROBE 300-M

    verified-listing-icon

    Verified

    CATEGORY
    Metrology

    Last Verified: Over 60 days ago

    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    65311

    Wafer Sizes:

    Unknown

    Vintage:

    2014

    Have Additional Questions?
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    FOGALE Nanotech DEEPROBE 300-M

    FOGALE Nanotech

    DEEPROBE 300-M

    Metrology
    Vintage: 2014Condition: Used
    Last VerifiedOver 60 days ago

    FOGALE Nanotech

    DEEPROBE 300-M

    verified-listing-icon
    Verified
    CATEGORY
    Metrology
    Last Verified: Over 60 days ago
    listing-photo-ee62b1b88bf8418581a8e2ec6e1a3dd8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/ee62b1b88bf8418581a8e2ec6e1a3dd8/b6967029681f437793aa48874c796609_a07b6f7e993e45469312c334ca2450ff1201a_mw.jpeg
    listing-photo-ee62b1b88bf8418581a8e2ec6e1a3dd8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/ee62b1b88bf8418581a8e2ec6e1a3dd8/9356a82a06ce458885b2a1ca1f3af8f0_c867c35ca1da4763959ca4b2039dd4581201a_mw.jpeg
    listing-photo-ee62b1b88bf8418581a8e2ec6e1a3dd8-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/1148/ee62b1b88bf8418581a8e2ec6e1a3dd8/e8462c4b759f4d98a54c63c4936c72f9_de979439bba24064ba701c03ac344b5f1201a_mw.jpeg
    Key Item Details
    Condition:

    Used

    Operational Status:

    Unknown

    Product ID:

    65311

    Wafer Sizes:

    Unknown

    Vintage:

    2014

    Logistics Support
    Available
    Money Back Guarantee
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    No description
    Configuration
    Technology: Low Conherence IR interferometry for step high measurement Applications: High A/R TSV depth measurement for 200 and 300mm wafer (Via first & Middle) Benefits: Non destructieve Technology Fast and easy to use CCD camera for spot positioning and pattern recognition Adjustable Metrology spot size TSV diameter > 2um A:R up to 30 Calibration and maintenance free
    OEM Model Description
    SEM / TEM / FIB
    Documents

    No documents

    Similar Listings
    View All
    FOGALE Nanotech DEEPROBE 300-M

    FOGALE Nanotech

    DEEPROBE 300-M

    MetrologyVintage: 2014Condition: UsedLast Verified: Over 60 days ago