Description
- Automatic Mask Aligner - Top Side Alignment (TSA) - 4" Vacuum Chuck (inquire for other sizes) - 5" x 5" Mask Holder (inquire for other sizes) - Up to 8"/200mm wafer capable - Cassette to Cassette Operation - Pre-Aligner: Through and Reflective Sensor - UV400 High Resolution Optics - Robot: Genmark GB4 - 1000W Lamp House - CIC1200 Power Supply - Wafer Flat Check Camera Option Included - Ring Field Illumination for TSA Option Included - Isolation table (included in main body)Configuration
1000W Lamphouse Cassette to Cassette Handling Set up for 4 Wafers", Up to 8" CapableOEM Model Description
Alignment + Exposure + UV Bonding up to 200 mmDocuments
No documents
SUSS MicroTec / KARL SUSS
MA200 COMPACT
Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82451
Wafer Sizes:
8"/200mm
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Similar Listings
View AllSUSS MicroTec / KARL SUSS
MA200 COMPACT
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
82451
Wafer Sizes:
8"/200mm
Vintage:
2010
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
- Automatic Mask Aligner - Top Side Alignment (TSA) - 4" Vacuum Chuck (inquire for other sizes) - 5" x 5" Mask Holder (inquire for other sizes) - Up to 8"/200mm wafer capable - Cassette to Cassette Operation - Pre-Aligner: Through and Reflective Sensor - UV400 High Resolution Optics - Robot: Genmark GB4 - 1000W Lamp House - CIC1200 Power Supply - Wafer Flat Check Camera Option Included - Ring Field Illumination for TSA Option Included - Isolation table (included in main body)Configuration
1000W Lamphouse Cassette to Cassette Handling Set up for 4 Wafers", Up to 8" CapableOEM Model Description
Alignment + Exposure + UV Bonding up to 200 mmDocuments
No documents