Description

- Operations Manual and Documentation Remanufactured by Suss Reman October 2024

Configuration

- Configured for Top Side & Bottom Side Alignment (TSA/BSA) - EISS 2.0 - Enhanced Image Storage System EISS 2.0 (microscope, cameras and frame grabber for BSA) - DVM8 Splitfield Microscope - Brand New LED Lamphouse Upgrade - BSA Chuck: One Chuck included - Maskholder: One Maskholder included - UV400 Optics (for 365nm and 405nm exposure) - Capable of Hard, Soft, Vacuum, and Proximity Contact - Power: 200-240V, 50/60 Hz

OEM Model Description

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production. MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications. After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies: Bond alignment near-field holographic lithography , UV processing UV curing nanoimprinting, etc.