Description
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: joystick & cic controller & mapping sensor abnormal, robotConfiguration
No ConfigurationOEM Model Description
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.Documents
No documents
CATEGORY
Mask/Bond Aligners
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136201
Wafer Sizes:
8"/200mm
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
SUSS MicroTec / KARL SUSS
MA300 Plus
CATEGORY
Mask/Bond Aligners
Last Verified: 15 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
136201
Wafer Sizes:
8"/200mm
Vintage:
2007
Logistics Support
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Exposure Aligner Off Status: COLD Deminsion (cm): 180x180x230 Weight kg: 1,200.00 2F Rigging (Yes or No): No Missing parts: joystick & cic controller & mapping sensor abnormal, robotConfiguration
No ConfigurationOEM Model Description
The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.Documents
No documents