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Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.Documents
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Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120507
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG6200-Infinity
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
120507
Wafer Sizes:
Unknown
Vintage:
2004
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
No ConfigurationOEM Model Description
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.Documents
No documents