Description
Tool is deinstalled and cratedConfiguration
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM Model Description
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.Documents
No documents
EVGroup (EVG)
EVG6200-Infinity
Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
51170
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
EVGroup (EVG)
EVG6200-Infinity
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
51170
Wafer Sizes:
8"/200mm
Vintage:
Unknown
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Tool is deinstalled and cratedConfiguration
– Wafer Configuration: 9″ inch mask holder square, 8″ wafer chuck – Double-sided / Backside Alignment Capability – Manual Load – Motorized illuminator 1000w lamp (joystick)– Manual XYZ stage (coarse and fine adjustments– Includes: PC, Lamp, Mirror and OptOEM Model Description
The EVG6200∞ Alignment System is a high-throughput, reliable, and accurate system for handling wafers and substrates up to 200mm. It features EV Group’s NanoAlign Technology for high alignment accuracy and resolution, making it competitive in full-field lithography. It is designed for wafer bumping, chip scale packaging, MEMS, Compound Semiconductor, Power Devices, and Nanotechnology applications. The system has a high degree of automation and can handle multiple wafer sizes with quick change-over time. It also has options for cassette-to-cassette handling, automatic alignment, and field upgrades.Documents
No documents