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EVGroup (EVG) EVG620
    Description
    Equipment purpose and function : The process of transferring the geometry of a photomask to the surface of a silicon wafer.
    Configuration
    -Single side unit S/N no. Configuration Describe 1 Wafer Diameter 150mm 2 Wafer Transfer System Manual 3 Control System Control Unit, Display, Touch Screen 4 Process Chamber Lamp 5 With mask holder 7X7 5 Voltage 230V/3 φ 6 Compressed 6 bar/87 psi 7 N2/CDA 6 bar/87 psi 8 Vacuum <850mbar/646Torr 9 Lamphouse 500W Equipment performance: Project Technical indicators Range of alignment X, Y: ± 5 mm Rotation Theta /- 3.5° Resolution 1.5μm (0.8um@vacuum chuck) Top side alignment 0.5μm (With 20x objective) Equipment light intensity The light intensity is around 1.5 mw /cm² Light intensity uniformity < 5 %
    OEM Model Description
    The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.
    Documents
    verified-listing-icon

    Verified

    CATEGORY
    Mask/Bond Aligners

    Last Verified: 4 days ago

    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    137501


    Wafer Sizes:

    6"/150mm


    Vintage:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Similar Listings
    View All
    EVGroup (EVG) EVG620

    EVGroup (EVG)

    EVG620

    Mask/Bond Aligners
    Vintage: 2006Condition: Used
    Last Verified4 days ago

    EVGroup (EVG)

    EVG620

    verified-listing-icon
    Verified
    CATEGORY
    Mask/Bond Aligners
    Last Verified: 4 days ago
    listing-photo-9ffecb9a969c47b1bacbb33c33245cf2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/43436/9ffecb9a969c47b1bacbb33c33245cf2/ebb2fbf4808f413e9889a0446b077ca6_image20251203165143784_mw.jpg
    listing-photo-9ffecb9a969c47b1bacbb33c33245cf2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/43436/9ffecb9a969c47b1bacbb33c33245cf2/a9ff7ee663bd42918693308db0dd0eaf_image20251203165142684_mw.jpg
    listing-photo-9ffecb9a969c47b1bacbb33c33245cf2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/43436/9ffecb9a969c47b1bacbb33c33245cf2/ed40b340146d47aab308174957503887_image20251203165141584_mw.jpg
    listing-photo-9ffecb9a969c47b1bacbb33c33245cf2-https://media-moov-co.s3.us-west-1.amazonaws.com/user_media/listingPhoto/43436/9ffecb9a969c47b1bacbb33c33245cf2/f18d789005fc4cf4a944888423f67543_image20251203165144884_mw.jpg
    Key Item Details

    Condition:

    Used


    Operational Status:

    Unknown


    Product ID:

    137501


    Wafer Sizes:

    6"/150mm


    Vintage:

    2006


    Logistics Support
    Available
    Transaction Insured by Moov
    Available
    Refurbishment Services
    Available
    Description
    Equipment purpose and function : The process of transferring the geometry of a photomask to the surface of a silicon wafer.
    Configuration
    -Single side unit S/N no. Configuration Describe 1 Wafer Diameter 150mm 2 Wafer Transfer System Manual 3 Control System Control Unit, Display, Touch Screen 4 Process Chamber Lamp 5 With mask holder 7X7 5 Voltage 230V/3 φ 6 Compressed 6 bar/87 psi 7 N2/CDA 6 bar/87 psi 8 Vacuum <850mbar/646Torr 9 Lamphouse 500W Equipment performance: Project Technical indicators Range of alignment X, Y: ± 5 mm Rotation Theta /- 3.5° Resolution 1.5μm (0.8um@vacuum chuck) Top side alignment 0.5μm (With 20x objective) Equipment light intensity The light intensity is around 1.5 mw /cm² Light intensity uniformity < 5 %
    OEM Model Description
    The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.
    Documents
    Similar Listings
    View All
    EVGroup (EVG) EVG620

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    Mask/Bond AlignersVintage: 2006Condition: UsedLast Verified:4 days ago
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    Mask/Bond AlignersVintage: 2005Condition: UsedLast Verified:Over 30 days ago
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    Mask/Bond AlignersVintage: 2008Condition: UsedLast Verified:Over 60 days ago