Description
No descriptionConfiguration
As is. Working condition before de-installation. Stored in clean roomOEM Model Description
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.Documents
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EVGroup (EVG)
EVG620
Verified
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83607
Wafer Sizes:
4"/100mm, 6"/150mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
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EVGroup (EVG)
EVG620
CATEGORY
Mask/Bond Aligners
Last Verified: Over 60 days ago
Key Item Details
Condition:
Used
Operational Status:
Unknown
Product ID:
83607
Wafer Sizes:
4"/100mm, 6"/150mm
Vintage:
2007
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
No descriptionConfiguration
As is. Working condition before de-installation. Stored in clean roomOEM Model Description
The EVG620 is a versatile tool developed by EV Group (EVG) that serves as both an optical double-side lithography and precision alignment system, specifically designed for wafers up to 100 mm in size. The system is capable of safely handling thick, bowed, or small diameter wafers, providing enhanced flexibility in wafer processing. The EVG620's alignment stage design is a standout feature, delivering highly accurate alignment and exposure results for precise patterning. It is equipped with high-resolution top and bottom side split-field microscopes, ensuring excellent imaging capabilities. The user-friendly interface, based on Windows, streamlines the operation of the EVG620, making it a reliable and efficient tool for various lithography and alignment applications in semiconductor and microelectronics manufacturing.Documents
No documents