Description
Spare PartsConfiguration
No ConfigurationOEM Model Description
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.Documents
No documents
KLA / VISTEC / LEICA
LDS3300 C
Verified
CATEGORY
Mask Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
101281
Wafer Sizes:
2"/50mm
Vintage:
2023
Have Additional Questions?
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
KLA / VISTEC / LEICA
LDS3300 C
CATEGORY
Mask Inspection
Last Verified: Over 30 days ago
Key Item Details
Condition:
Parts Tool
Operational Status:
Unknown
Product ID:
101281
Wafer Sizes:
2"/50mm
Vintage:
2023
Logistics Support
Available
Money Back Guarantee
Available
Transaction Insured by Moov
Available
Refurbishment Services
Available
Description
Spare PartsConfiguration
No ConfigurationOEM Model Description
System enables fully automated inspection of the 300mm wafer surface. The system's parallel processing capability allows simultaneous wafer inspection of the front / backside and the edge/bevel – at throughputs of up to 130 wafers per hour. A single rotation of the wafer is sufficient for wafer edge inspection to deliver the detection results and defect images. The image-based technology convinces with 1µm sensitivity and allows for optional high resolution microscopic review of defects.Documents
No documents