Description

MA 8 / BA 8 Gen 5 S Brand New in Crate

Configuration

- For imprint processing - Power supply: 3x 400V AC + N + PE / 50-60Hz - Max fuse rating machine: 30amp - Max fuse rating facility: 40amp - Connection cable: 5x AWG8 length 16ft / 5m open end, no connector Vacuum: - <-80 kPa - Outer tube diameter: 6mm - Max length: 2m Clean Dry Air (CDA): - 0,5 to 0,8 MPa - According to purity level ISO 8573-1:2010, [5:6:4] - Outer tube diameter: 6mm CDA Consumption: ca. 1 m3/h (LH350) Nitrogen (N2): - 0,2 to 0,5 MPa - Outer tube diameter: 6mm Voltage/Frequency: - 200-240 V, L1/N/PE, or L1/L2/PE, 50/60hz AIC or main interrupt and breakers: 15 kA IEC SCCR (Short Circuit Current Rating) of overall equipment: 5 kA Apparent Power: - ca. 1,7 kVA max, inc. CIC1200 and 350 W lamp - ca. 1,0 kVA max, Bond Aligner without lamp Power Cable: - KABEL OELFLEX 491P BK 3 G2.5 RU AWM CSA - Cable length = 3 m Power Plug: G146853 European Schuko Plug 16A/250V CEE7/7

OEM Model Description

SUSS MA8 mask alignment lithography machine is a lithography application solution developed for the R&D and trial production of 200mm IC back-end process. MA8 can fully meet the powerful functions and flexibility required by the laboratory. The compatibility of the exposure mode fully allows the process developed on the MA8 to be transplanted to the MA200 production mask alignment lithography machine of SUSS , and be applied in actual production. MA8 can meet the needs of back-end processes, such as passivation and thin film bumping technology. Similarly, thick resist lithography and backside alignment capabilities make MA8 also have great application prospects in microsystem technology. In addition, MA8 is also considered as an ideal tool for communication and optoelectronic applications. After adopting the low-diffraction exposure system, in addition to high-resolution standard lithography applications, the MA8 mask alignment lithography machine can also complete the following special technologies: Bond alignment near-field holographic lithography , UV processing UV curing nanoimprinting, etc.