The MA300Plus is a highly automated mask aligner for 300mm and 200mm wafers. It is specifically designed for wafer bumping and wafer level packaging applications but can be used as well for other technologies where geometries in the range of 3 and 100 microns have to be exposed.

SUSS MicroTec offers a wide product portfolio of high quality process solutions for the semiconductor industry and related markets. SUSS portfolio covers a comprehensive range of products and solutions for backend lithography, wafer bonding, and photomask processing, complemented by micro-optical components. 

SUSS MicroTec / KARL SUSS

MA300 Plus

Exposure
Aligner

Off Status: COLD	
Deminsion (cm): 180x180x230
Weight kg: 1,200.00
2F Rigging (Yes or No): No
Missing parts: joystick & cic controller & mapping sensor abnormal, robot

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Exposure
Aligner

Off Status: COLD	
Deminsion (cm): 180x180x230
Weight kg: 1,200.00
2F Rigging (Yes or No): No
Missing parts: All internal parts are damaged, leaving only the skeleton

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180x180x230
1,200.00 Kg
Joystick & cic controller & mapping sensor abnormal,robot

MA300 Plus

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SUSS MicroTec / KARL SUSS

MA300 Plus

SUSS MicroTec / KARL SUSS

MA300 Plus

SUSS MicroTec / KARL SUSS

MA300 Plus

SUSS MicroTec / KARL SUSS

MA300 Plus

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